JOB DETAILS

JOB DETAIL

• Take ownership of maintenance strategies and continuous improvement initiatives for trim and form systems across multiple package configurations.
• Work closely with process engineering to support design validation of new products through development and qualification, ensuring readiness for high-volume manufacturing.
• Coordinate with cross-functional partners to create, review, and maintain technical documentation including control plans, process specs, SOPs, FMEAs, and engineering reports.
• Define and manage technician staffing plans to sustain 24/7 manufacturing operations, ensuring effective task delegation and clear operational visibility.
• Coach and develop technician capabilities, reinforcing technical knowledge, engineering thinking, KPI tracking, and annual performance assessments.
• Interface with R&D, NPI, product design, and reliability teams to ensure trim and form capabilities align with package design and process requirements.
• Lead root-cause analysis and resolution of trim and form related quality issues and defects.
• Oversee spare parts planning, inventory control, and procurement activities.
• Coordinate with external suppliers for tooling, jigs, and fixtures, tracking delivery schedules for both critical and non-critical items.
• Operate effectively within a high-volume, fast-paced manufacturing environment.

REQUIRED WORK EXPERIENCE

• Bachelor’s degree in an engineering field.
• At least 5 years of semiconductor industry experience, including a minimum of 3 years focused on trim and form processes and tooling.
• Demonstrated hands-on technical expertise working with trim and form equipment in semiconductor packaging.
• Strong analytical and problem-solving skills.
• Good communication skills in English.